Daniel J. Belton,
Michael Gaynes,
Elizabeth G. Jacobs
Electronic Packaging Materials Science X: Volume 515
Gebonden Engels 1998 9781558994218
Verwachte levertijd ongeveer 9 werkdagen
Samenvatting
Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.
Specificaties
ISBN13:9781558994218
Taal:Engels
Bindwijze:Gebonden
Aantal pagina's:262
Uitgever:Materials Research Society
Serie:MRS Proceedings
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