Xingsheng Liu,
Wei Zhao,
Lingling Xiong,
Hui Liu
e.a.
Packaging of High Power Semiconductor Lasers
Paperback Engels 2016 9781493955909
Verwachte levertijd ongeveer 9 werkdagen
Samenvatting
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Specificaties
ISBN13:9781493955909
Taal:Engels
Bindwijze:paperback
Uitgever:Springer New York
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Inhoudsopgave
<p>Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.</p>
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